Invention Application
- Patent Title: Thermal management arrangement with channels structurally adapted for varying heat flux areas
- Patent Title (中): 热管理结构，其结构适用于不同的热通量区域
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Application No.: US10877925Application Date: 2004-06-25
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Publication No.: US20050285261A1Publication Date: 2005-12-29
- Inventor: Ravi Prasher , Chia-Pin Chiu , Himanshu Pokharna
- Applicant: Ravi Prasher , Chia-Pin Chiu , Himanshu Pokharna
- Main IPC: F28D15/02
- IPC: F28D15/02 ; H01L23/34 ; H01L23/427 ; H01L23/473
Abstract:
An apparatus, method, and system for a thermal management arrangement for cooling semiconductor packages with channels structurally adapted for varying heat flux areas.
Information query
