发明申请
- 专利标题： Chemical mechanical polishing compositions and methods relating thereto
- 专利标题（中）： 化学机械抛光组合物及其相关方法
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申请号： US10882568申请日： 2004-07-01
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公开(公告)号： US20060000151A1公开(公告)日： 2006-01-05
- 发明人: Francis Kelley , John Quanci , Joseph So , Hongyu Wang
- 申请人： Francis Kelley , John Quanci , Joseph So , Hongyu Wang
- 主分类号： B24D3/00
- IPC分类号： B24D3/00 ; B24D11/00
摘要：
The present invention provides an aqueous composition useful for CMP of a semiconductor wafer containing a metal comprising oxidizer, inhibitor for a nonferrous metal, complexing agent for the nonferrous metal, modified cellulose, 0.001 to 10% by weight copolymer blends of a first copolymer and a second copolymer and balance water.
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