发明申请
- 专利标题: Flexible metal foil/polyimide laminate and making method
- 专利标题(中): 柔性金属箔/聚酰亚胺层压板及其制造方法
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申请号: US11171198申请日: 2005-07-01
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公开(公告)号: US20060003173A1公开(公告)日: 2006-01-05
- 发明人: Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
- 申请人: Masahiro Usuki , Makoto Fujiwara , Shigehiro Hoshida , Michio Aizawa , Tadashi Amano
- 申请人地址: JP Tokyo
- 专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人: Shin-Etsu Chemical Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2004-197759 20040705
- 主分类号: B32B15/08
- IPC分类号: B32B15/08
摘要:
In a flexible metal foil/polyimide laminate comprising in sequence, a heat resistant polyimide film, an adhesive layer, and a metal foil, the adhesive layer is a polyimide adhesive layer with a Tg of at least 400° C., obtained by heat imidization of a polyamic acid varnish containing 5-200 ppm of a leveling agent, typically polyether-modified silicone. This laminate of the all polyimide type takes full advantage of the properties of heat resistant polyimide film, includes the adhesive layer having a smooth surface, and is free of thickness variations.
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