发明申请
- 专利标题： Assemblies including semiconductor substrates of reduced thickness and support structures therefor
- 专利标题（中）： 组件包括厚度减小的半导体衬底及其支撑结构
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申请号： US11216866申请日： 2005-08-31
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公开(公告)号： US20060003549A1公开(公告)日： 2006-01-05
- 发明人: Alan Wood , Warren Farnworth , David Hembree , Sidney Rigg , William Hiatt , Peter Benson , Kyle Kirby , Salman Akram
- 申请人： Alan Wood , Warren Farnworth , David Hembree , Sidney Rigg , William Hiatt , Peter Benson , Kyle Kirby , Salman Akram
- 主分类号： H01L21/30
- IPC分类号： H01L21/30
摘要：
A fabrication substrate for use in fabricating integrated circuits and other electronic devices includes a substrate that comprises semiconductor material, as well as a support structure on an active surface of the substrate. The support structure is located at or adjacent to an entire outer peripheral edge of the substrate. The support structure may be configured as a ring-like element or as a member which substantially covers an active surface of the semiconductor substrate and forms a protective structure over each semiconductor device carried by the active surface.
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