- 专利标题： Semiconductor devices with permanent polymer stencil and method for manufacturing the same
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申请号： US11210606申请日： 2005-08-23
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公开(公告)号： US20060003569A1公开(公告)日： 2006-01-05
- 发明人: Warren Farnworth , Alan Wood , James Wark , David Hembree , Syed Ahmad , Michael Hess , John Jacobson
- 申请人： Warren Farnworth , Alan Wood , James Wark , David Hembree , Syed Ahmad , Michael Hess , John Jacobson
- 主分类号： H01L21/44
- IPC分类号： H01L21/44
摘要：
Methods of manufacturing semiconductor devices using permanent or temporary polymer layers having apertures to expose contact pads and cover the active surfaces of the semiconductor devices.
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