- 专利标题: Semiconductor devices having a metal-insulator-metal capacitor and methods of forming the same
-
申请号: US11180954申请日: 2005-07-12
-
公开(公告)号: US20060006447A1公开(公告)日: 2006-01-12
- 发明人: Hyun-Ho Kim , Heung-Jin Joo , Ki-Nam Kim
- 申请人: Hyun-Ho Kim , Heung-Jin Joo , Ki-Nam Kim
- 申请人地址: KR Suwon-Si
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si
- 优先权: KR2004-54049 20040712
- 主分类号: H01L27/108
- IPC分类号: H01L27/108
摘要:
A semiconductor device having an MIM capacitor and a method of forming the same are provided. A lower electrode includes a plate electrode and a sidewall electrode. The plate electrode is formed by a patterning process preferably including a plasma anisotropic etching. The sidewall electrode is formed like a spacer on an inner sidewall of an opening exposing the plate electrode by a plasma entire surface anisotropic etching.
公开/授权文献
信息查询
IPC分类: