发明申请
- 专利标题: Surface acoustic wave device, its manufacturing method, and electronic circuit device
- 专利标题(中): 声表面波装置及其制造方法和电子电路装置
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申请号: US11220815申请日: 2005-09-07
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公开(公告)号: US20060006760A1公开(公告)日: 2006-01-12
- 发明人: Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
- 申请人: Akihiko Namba , Keiji Onishi , Yasuhiro Sugaya , Katsunori Moritoki
- 优先权: JP2001-29079 20010206; JP2001-82149 20010322; JP2001-147377 20010517
- 主分类号: H01L41/04
- IPC分类号: H01L41/04
摘要:
A surface acoustic wave device which occupies a small mounting area and has a low profile, yet having an improved reliability, and can be made available at low cost. The surface acoustic wave device comprises a piezoelectric substrate, a function region formed of comb-like electrodes for exciting surface acoustic wave provided on a main surface of the piezoelectric substrate, a space formation member covering the function region, a plurality of bump electrodes provided on a main surface of the piezoelectric substrate and a terminal electrode provided opposed to the main surface of piezoelectric substrate. The bump electrode and the terminal electrode are having a direct electrical connection, and a space between piezoelectric substrate and terminal electrode is filled with resin. When the above-configured acoustic wave device is applied for a frequency filter, a resonator, in a portable telephone unit, a keyless entry or the like communication apparatus, the overall size of such apparatus can be reduced and a higher reliability is implemented.
公开/授权文献
- US07246421B2 Method for manufacturing surface acoustic wave device 公开/授权日:2007-07-24
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