Invention Application
US20060010818A1 Flooring panels 有权
地板

  • Patent Title: Flooring panels
  • Patent Title (中): 地板
  • Application No.: US11229718
    Application Date: 2005-09-20
  • Publication No.: US20060010818A1
    Publication Date: 2006-01-19
  • Inventor: Franz Knauseder
  • Applicant: Franz Knauseder
  • Applicant Address: AT Salzburg
  • Assignee: M. KAINDL.
  • Current Assignee: M. KAINDL.
  • Current Assignee Address: AT Salzburg
  • Priority: ATA992/2000 20000606
  • Main IPC: E04C3/00
  • IPC: E04C3/00 E04B2/08
Flooring panels
Abstract:
A method of connecting structural components having a relatively low thickness, the method including pre-applying, at an off-site location, one of an adhesive and a substance which activates an adhesive to at least one of at least one of the sides of the groove of one of the structural components and at least one of the sides of the tongue of another of the structural components, and connecting, at a site different from the off-site location, the structural components together by causing the tongue to be inserted into the groove.
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