Invention Application
- Patent Title: Flooring panels
- Patent Title (中): 地板
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Application No.: US11229718Application Date: 2005-09-20
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Publication No.: US20060010818A1Publication Date: 2006-01-19
- Inventor: Franz Knauseder
- Applicant: Franz Knauseder
- Applicant Address: AT Salzburg
- Assignee: M. KAINDL.
- Current Assignee: M. KAINDL.
- Current Assignee Address: AT Salzburg
- Priority: ATA992/2000 20000606
- Main IPC: E04C3/00
- IPC: E04C3/00 ; E04B2/08

Abstract:
A method of connecting structural components having a relatively low thickness, the method including pre-applying, at an off-site location, one of an adhesive and a substance which activates an adhesive to at least one of at least one of the sides of the groove of one of the structural components and at least one of the sides of the tongue of another of the structural components, and connecting, at a site different from the off-site location, the structural components together by causing the tongue to be inserted into the groove.
Public/Granted literature
- US07897005B2 Flooring panels Public/Granted day:2011-03-01
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