发明申请
- 专利标题： Semiconductor chip resin encapsulation method
- 专利标题（中）： 半导体芯片树脂封装方法
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申请号： US11178278申请日： 2005-07-12
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公开(公告)号： US20060012056A1公开(公告)日： 2006-01-19
- 发明人: Shinji Ueno , Akihito Kawai
- 申请人： Shinji Ueno , Akihito Kawai
- 专利权人： Disco Corporation
- 当前专利权人： Disco Corporation
- 优先权： JP2004-205922 20040713
- 主分类号： H01L23/28
- IPC分类号： H01L23/28
摘要：
A semiconductor chip resin encapsulation method, including a resin filling and curing step of encapsulating a plurality of semiconductor chips, which have been bonded onto a substrate, in a molten resin, and curing the molten resin. The semiconductor chip resin encapsulation method further includes a grinding step of grinding an upper surface of the cured resin to decrease the thickness of the encapsulating resin to a predetermined value.
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