发明申请
US20060013850A1 Electropolymerizable monomers and polymeric coatings on implantable devices prepared therefrom
审中-公开
由其制备的可植入装置上的电聚合单体和聚合物涂层
- 专利标题： Electropolymerizable monomers and polymeric coatings on implantable devices prepared therefrom
- 专利标题（中）： 由其制备的可植入装置上的电聚合单体和聚合物涂层
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申请号： US11183850申请日： 2005-07-19
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公开(公告)号： US20060013850A1公开(公告)日： 2006-01-19
- 发明人: Abraham Domb
- 申请人： Abraham Domb
- 主分类号： A61K9/14
- IPC分类号： A61K9/14 ; A61F13/00
摘要：
Conductive surfaces of e.g., implantable devices, coated with electropolymerized polymers having active substances attached thereto are disclosed. Electropolymerizable monomers designed and used for obtaining such conductive surfaces and processes, devices and methods for attaching the electropolymerized polymers to conductive surfaces are also disclosed. The polymers, processes and devices presented herein can be beneficially used in the preparation of implantable medical devices.
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