发明申请
- 专利标题： Pulsed current sintering for surfaces of medical implants
- 专利标题（中）： 医用植入物表面的脉冲电流烧结
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申请号： US11183456申请日： 2005-07-18
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公开(公告)号： US20060015187A1公开(公告)日： 2006-01-19
- 发明人: Gordon Hunter , Vivek Pawar , Daniel Heuer , Abraham Salehi , Michael Cooper
- 申请人： Gordon Hunter , Vivek Pawar , Daniel Heuer , Abraham Salehi , Michael Cooper
- 申请人地址： US TN Memphis
- 专利权人： Smith & Nephew Inc.
- 当前专利权人： Smith & Nephew Inc.
- 当前专利权人地址： US TN Memphis
- 主分类号： A61F2/28
- IPC分类号： A61F2/28
摘要：
A porous medical implant and a method of making same is described. The medical implant comprises a porous surface formed by application of pulsed electrical energy ins such a way as to cause a localized heating in the surface of the material comprising portions of the implant. The method comprises a pulsed current sintering technique.
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