发明申请
- 专利标题： Heat dissipating device
- 专利标题（中）： 散热装置
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申请号： US11135575申请日： 2005-05-23
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公开(公告)号： US20060018096A1公开(公告)日： 2006-01-26
- 发明人: Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
- 申请人： Chun-Chi Chen , Shi-Wen Zhou , Meng Fu , Chi Liang
- 申请人地址： TW Tu-Cheng City
- 专利权人： Foxconn Technology Co., Ltd.
- 当前专利权人： Foxconn Technology Co., Ltd.
- 当前专利权人地址： TW Tu-Cheng City
- 优先权： CN200410050828.4 20040722
- 主分类号： H05K7/20
- IPC分类号： H05K7/20
摘要：
A heat dissipating device includes a heat sink and a protecting device attached to the heat sink. The heat sink includes a plurality of individual fins in assembly. The protecting device is made from plastic. The protecting device includes a lath resting on the fins, and a plurality of ribs beneath the lath. The ribs are interposed between the fins.
公开/授权文献
- US07218522B2 Heat dissipating device 公开/授权日：2007-05-15
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