A pressure-sensitive adhesive tape which comprises a resin film and a pressure-sensitive adhesive layer formed on at least one side of the film, and which has a concave-convex form containing plural grooves arranged at given intervals in a face of the pressure-sensitive adhesive layer that is to be stuck onto an adherend, and has a region where the interval of the arrangement of the grooves is 400 μm or more, the tensile modulus of the pressure-sensitive adhesive tape in the temperature range of 23 to 80° C. being in the range of 30 to 600 MPa. This tape has such an excellent workability that when the tape is stuck onto an adherend, air bubbles escape easily therefrom so as to prevent the generation of defects based on the entrainment of the air bubbles.