发明申请
- 专利标题： Heat-resistant flexible laminated board manufacturing method
- 专利标题（中）： 耐热柔性层压板的制造方法
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申请号： US10532827申请日： 2003-10-27
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公开(公告)号： US20060021699A1公开(公告)日： 2006-02-02
- 发明人: Naoki Hase , Shinji Matsukubo , Hiroyuki Tsuji , Yasuo Fushiki
- 申请人： Naoki Hase , Shinji Matsukubo , Hiroyuki Tsuji , Yasuo Fushiki
- 优先权： JP2002-323966 20021107
- 国际申请： PCT/JP03/13739 WO 20031027
- 主分类号： B29C65/00
- IPC分类号： B29C65/00 ; B32B37/00
摘要：
A laminate having good appearance, which avoids such a problem that end waviness is produced in the laminate during lamination, thus making it impossible to fix the laminate in the process for formation of a circuit pattern. A method of producing a laminate is disclosed which comprises continuously laminating a heat-resistant film having thermal fusibility with a metallic foil, characterized in that the temperature of the ends of the laminate is the same as or higher than that of the center portion in the cooling process after lamination.