发明申请
- 专利标题: Liquid cooling device
- 专利标题(中): 液体冷却装置
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申请号: US11168069申请日: 2005-06-28
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公开(公告)号: US20060021737A1公开(公告)日: 2006-02-02
- 发明人: Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
- 申请人: Hsieh-Kun Lee , Cheng-Tien Lai , Zhi-Yong Zhou
- 申请人地址: TW Tu-Cheng City
- 专利权人: Foxconn Technology Co., Ltd.
- 当前专利权人: Foxconn Technology Co., Ltd.
- 当前专利权人地址: TW Tu-Cheng City
- 优先权: CN200410050971.3 20040731
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A liquid cooling device includes a hollow heat absorbing unit (2) containing liquid therein, a first heat exchange body (32) and a second heat exchange body (34). The first heat exchange body defines isolated first and second rooms (330, 331) therein. The second heat exchange body defines flow-communicated first and second chambers (350, 351) therein. The first chamber is communicated to the first room, and the second chamber is communicated to the second room. The liquid cooling device further includes a pump (4) fluidly connected between the heat absorbing unit and the second room, and a pipe (7) fluidly connecting the heat absorbing unit and the first room.
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