- 专利标题： Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
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申请号： US11191942申请日： 2005-07-29
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公开(公告)号： US20060022326A1公开(公告)日： 2006-02-02
- 发明人: Toshiaki Morita , Hiroshi Hozoji , Kazuhiro Suzuki
- 申请人： Toshiaki Morita , Hiroshi Hozoji , Kazuhiro Suzuki
- 优先权： JP2004-221918 20040729
- 主分类号： H01L23/52
- IPC分类号： H01L23/52
摘要：
A semiconductor device which uses a semiconductor element having main current input/output electrodes, one and the other of which are extended up to a one surface and a remaining surface of a semiconductor chip respectively for causing one of the input/output electrodes to be contacted with a conductive layer of a insulating substrate, whereby the semiconductor element is supported on or above the insulating substrate. A conductive strip which is made of a composite material of carbon and aluminum or a composite material of carbon and copper is used for connection between the remaining input/output electrode of the semiconductor chip and the conductive layer of the insulating substrate.