An article comprising a substrate and a patterned electrically conductive metal phase, wherein the electrically conductive metal phase is selectively deposited on the substrate via sequential or simultaneous ink jetting of combinations of a reducible soluble metal salt, a reduction catalyst and a reducing agent. On substrates having layered structures, the selectively deposited electrically conductive metal phase is intertwined with the substrate microstructure. A method of forming the same is also provided. In a particular embodiment of the method, the selective deposition of the electrically conductive phase onto the substrate comprises a first jetting of a composition comprising the reducible soluble metal salt and the reduction catalyst in a predetermined area followed by a subsequent jetting of a composition comprising the reducible metal salt and the reducing agent over the same predetermined area.