发明申请
US20060024897A1 Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions 有权
制造具有分离器件区域的集成电路的横向MOSFET结构的方法

  • 专利标题: Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions
  • 专利标题(中): 制造具有分离器件区域的集成电路的横向MOSFET结构的方法
  • 申请号: US11238344
    申请日: 2005-09-29
  • 公开(公告)号: US20060024897A1
    公开(公告)日: 2006-02-02
  • 发明人: James Beasom
  • 申请人: James Beasom
  • 专利权人: Intersil Americas Inc.
  • 当前专利权人: Intersil Americas Inc.
  • 主分类号: H01L21/336
  • IPC分类号: H01L21/336
Method of manufacturing lateral MOSFET structure of an integrated circuit having separated device regions
摘要:
Apparatus and Methods for the self-alignment of separated regions in a lateral MOSFET of an integrate circuit. In one embodiment, a method comprising, forming a relatively thin dielectric layer on a surface of a substrate. Forming a first region of relatively thick material having a predetermined lateral length on the surface of the substrate adjacent the relatively thin dielectric layer. Implanting dopants to form a top gate using a first edge of the first region as a mask to define a first edge of the top gate. Implanting dopants to form a drain contact using a second edge of the first region as a mask to define a first edge of the drain contact, wherein the distance between the top gate and drain contact is defined by the lateral length of the first region.
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