发明申请
US20060024900A1 Interposer including at least one passive element at least partially defined by a recess formed therein, method of manufacture, system including same, and wafer-scale interposer
有权
内插件包括至少部分地由形成在其中的凹部限定的无源元件，制造方法，包括其的系统以及晶片级内插器
- 专利标题： Interposer including at least one passive element at least partially defined by a recess formed therein, method of manufacture, system including same, and wafer-scale interposer
- 专利标题（中）： 内插件包括至少部分地由形成在其中的凹部限定的无源元件，制造方法，包括其的系统以及晶片级内插器
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申请号： US10923437申请日： 2004-08-19
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公开(公告)号： US20060024900A1公开(公告)日： 2006-02-02
- 发明人: Teck Lee
- 申请人： Teck Lee
- 优先权： SG200404289-1 20040729
- 主分类号： H01L21/20
- IPC分类号： H01L21/20 ; H01L21/8244
摘要：
An interposer for assembly with a semiconductor die and methods of manufacture are disclosed. The interposer may include at least one passive element at least partially defined by at least one recess formed in at least one dielectric layer of the interposer. The at least one recess may have dimensions selected for forming the passive element with an intended magnitude of at least one electrical property. At least one recess may be formed by removing at least a portion of at least one dielectric layer of an interposer. The at least one recess may be at least partially filled with a conductive material. For instance, moving, by way of squeegee, or injection of a conductive material at least partially within the at least one recess, is disclosed. Optionally, vibration of the conductive material may be employed. A wafer-scale interposer and a system including at least one interposer are disclosed.
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