Invention Application
US20060025542A1 Compositions containing oxetane compounds for use in semiconductor packaging
有权
含有用于半导体封装的氧杂环丁烷化合物的组合物
- Patent Title: Compositions containing oxetane compounds for use in semiconductor packaging
- Patent Title (中): 含有用于半导体封装的氧杂环丁烷化合物的组合物
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Application No.: US10901631Application Date: 2004-07-29
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Publication No.: US20060025542A1Publication Date: 2006-02-02
- Inventor: Osama Musa
- Applicant: Osama Musa
- Main IPC: C08L101/06
- IPC: C08L101/06 ; C08G65/18
Abstract:
Compositions containing oxetane compounds having ester, amide, urea, carbamate, carbonate, or carbonyl functionality one carbon atom removed from the oxetane ring cure at high temperatures are suitable for use as underfill materials within a semiconductor package, particularly in applications using lead free solder electrical interconnections. A suitable oxetane compound has the structure:
Public/Granted literature
- US07230055B2 Compositions containing oxetane compounds for use in semiconductor packaging Public/Granted day:2007-06-12
Information query
