A cure oven comprises a sealable door and one or more pressure valves mounted inside for curing optical subcomponents that have been assembled using an adhesive. The cure oven comprises a chamber that can be configured to receive several hundreds of assembled optical subcomponents. The cure oven is further coupled to a computerized system via a drive motor. The computerized system initiates the heating and cooling sequences, and indicates whether the door can be opened, or must remain shut. The cure oven maintains a certain pressure inside the oven chamber consistent with a rise in temperature, allowing assembled optical subcomponents to be cured at a much higher rate than possible without disassembling, or being damaged.