- 专利标题: Polishing apparatus
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申请号: US11201307申请日: 2005-08-11
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公开(公告)号: US20060035571A1公开(公告)日: 2006-02-16
- 发明人: Makoto Nakajima , Yoshio Nakamura , Tadakazu Miyashita
- 申请人: Makoto Nakajima , Yoshio Nakamura , Tadakazu Miyashita
- 专利权人: Fujikoshi Machinery Corp.
- 当前专利权人: Fujikoshi Machinery Corp.
- 优先权: JP2004-235213 20040812
- 主分类号: B24B29/00
- IPC分类号: B24B29/00
摘要:
An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a first pressing force pressing the outer member or an inner member upward and a second pressing force pressing the outer member or the inner member downward, which is produced in a first closed space by supplying a compressed fluid into and discharging the same from the first closed space, is adjusted, so that a third pressing force of the upper polishing plate, which presses a work piece, can be adjusted.
公开/授权文献
- US07115026B2 Polishing apparatus 公开/授权日:2006-10-03