发明申请
- 专利标题： Ultrasound probe wiring method and apparatus
- 专利标题（中）： 超声波探头接线方法及装置
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申请号： US11220136申请日： 2005-09-06
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公开(公告)号： US20060036179A1公开(公告)日： 2006-02-16
- 发明人: David Miller
- 申请人： David Miller
- 主分类号： A61B8/14
- IPC分类号： A61B8/14
摘要：
Wiring an IC, using flexible circuits, by relating a circuit board to an IC and using traces on the circuit board as a second set of input to the IC. More specifically, a set of first lands on the circuit board are connected to a first set of lands on the IC. The circuit board and IC are positioned so as to present a second set of lands on the circuit board in close proximity to a second set of lands on the IC A first flex circuit is connected to the second lands on the circuit board while a second flex circuit is connected to the second lands on the IC. The flex circuits may be connected to signal wires or may serve themselves as the main signal wires.
公开/授权文献
- US07715204B2 Ultrasound probe wiring apparatus 公开/授权日：2010-05-11
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