发明申请
- 专利标题： Fabrication method of light emitting diode incorporating substrate surface treatment by laser and light emitting diode fabricated thereby
- 专利标题（中）： 掺合了由其制造的激光和发光二极管的基板表面处理的发光二极管的制造方法
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申请号： US10953815申请日： 2004-09-30
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公开(公告)号： US20060038190A1公开(公告)日： 2006-02-23
- 发明人: Young Park , Hun Hahm , Kun Ko , Hyo Cho
- 申请人： Young Park , Hun Hahm , Kun Ko , Hyo Cho
- 申请人地址： KR Suwon
- 专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人： Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址： KR Suwon
- 优先权： KR2004-64535 20040817
- 主分类号： H01L33/00
- IPC分类号： H01L33/00
摘要：
The present invention relates to a fabrication method of LEDs incorporating a step of surface-treating a substrate by a laser and an LED fabricated by such a fabrication method. The present invention can use a laser in order to implement finer surface treatment to an LED substrate over the prior art. As a result, the invention can improve the light extraction efficiency of an LED while protecting the substrate from chronic problems of the prior art such as stress or defects induced from chemical etching and/or physical polishing.
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