发明申请
US20060039114A1 Method and system for measuring temperature and power distributions of a device in a package 失效
用于测量包装中的装置的温度和功率分布的方法和系统

Method and system for measuring temperature and power distributions of a device in a package
摘要:
A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.
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