发明申请
US20060039114A1 Method and system for measuring temperature and power distributions of a device in a package
失效
用于测量包装中的装置的温度和功率分布的方法和系统
- 专利标题: Method and system for measuring temperature and power distributions of a device in a package
- 专利标题(中): 用于测量包装中的装置的温度和功率分布的方法和系统
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申请号: US10919692申请日: 2004-08-17
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公开(公告)号: US20060039114A1公开(公告)日: 2006-02-23
- 发明人: Hendrik Hamann , James Lacey , Martin O'Boyle , Robert von Gutfeld , Jamil Wakil , Alan Weger
- 申请人: Hendrik Hamann , James Lacey , Martin O'Boyle , Robert von Gutfeld , Jamil Wakil , Alan Weger
- 申请人地址: US NY Armonk
- 专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人: INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址: US NY Armonk
- 主分类号: H05K7/20
- IPC分类号: H05K7/20
摘要:
A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant flows through a specially designed cell directly over the electronic device. In order to determine the chip power distributions the individual temperature fields for each heat source of a given power and size on the chip (as realized by a scanning focused laser beam) are measured under the same cooling conditions. Then the measured chip temperature distribution is represented as a superposition of the temperature fields of these individual heat sources and the corresponding power distribution is calculated with a set of linear equations.
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