发明申请
US20060039596A1 Pattern measuring method, pattern measuring apparatus, photo mask manufacturing method, semiconductor device manufacturing method, and computer program product
审中-公开
图案测量方法，图案测量装置，光掩模制造方法，半导体器件制造方法和计算机程序产品
- 专利标题： Pattern measuring method, pattern measuring apparatus, photo mask manufacturing method, semiconductor device manufacturing method, and computer program product
- 专利标题（中）： 图案测量方法，图案测量装置，光掩模制造方法，半导体器件制造方法和计算机程序产品
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申请号： US11205017申请日： 2005-08-17
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公开(公告)号： US20060039596A1公开(公告)日： 2006-02-23
- 发明人: Shigeki Nojima , Hiroshi Motoki , Takahiro Ikeda , Satoshi Tanaka , Takeshi Ito
- 申请人： Shigeki Nojima , Hiroshi Motoki , Takahiro Ikeda , Satoshi Tanaka , Takeshi Ito
- 优先权： JP2004-238535 20040818
- 主分类号： G06K9/00
- IPC分类号： G06K9/00
摘要：
A pattern measuring method includes preparing a substrate comprising a pattern, extracting a place to be measured on the substrate based on a simulation using pattern data relating to the pattern as input data, generating measurement information for measuring a physical quantity of the place to be measured by a measuring apparatus, and measuring the place to be measured based on the measurement information by the measuring apparatus.
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