发明申请
- 专利标题： Air pocket resistant semiconductor package
- 专利标题（中）： 防空气袋半导体封装
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申请号： US11215090申请日： 2005-08-29
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公开(公告)号： US20060043564A1公开(公告)日： 2006-03-02
- 发明人: Antonio Dimaano , Byung Do , Dennis Guillermo , Sheila Rima Magno
- 申请人： Antonio Dimaano , Byung Do , Dennis Guillermo , Sheila Rima Magno
- 申请人地址： SG Singapore
- 专利权人： STATS ChipPAC Ltd.
- 当前专利权人： STATS ChipPAC Ltd.
- 当前专利权人地址： SG Singapore
- 主分类号： H01L23/24
- IPC分类号： H01L23/24
摘要：
A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An encapsulant encapsulates the die, the substrate, at least a portion of the heat spreader, the first encapsulant guide, and the heat spreader air vent such that the encapsulant enters the heat spreader through the first encapsulant guide and air exits the heat spreader through the heat spreader air vent, thus preventing the formation of air pockets under the heat spreader.
公开/授权文献
- US07141886B2 Air pocket resistant semiconductor package 公开/授权日：2006-11-28
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