- 专利标题： Method for heat dissipation on semiconductor device
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申请号： US10930590申请日： 2004-08-31
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公开(公告)号： US20060043582A1公开(公告)日： 2006-03-02
- 发明人: Zachary Prather , Steven Reder , Michael Berman
- 申请人： Zachary Prather , Steven Reder , Michael Berman
- 主分类号： H01L23/34
- IPC分类号： H01L23/34
摘要：
A device and method wherein a thermo electric generator device is disposed between stacks of a multiple level device, or is provided on or under a die of a package and is conductively connected to the package. The thermo electric generator device is configured to generate a voltage by converting heat into electric power. The voltage which is generated by the thermo electric generator can be recycled back into the die itself, or to a higher-level unit in the system, even to a cooling fan.
公开/授权文献
- US08404960B2 Method for heat dissipation on semiconductor device 公开/授权日：2013-03-26