发明申请
- 专利标题： LOW STRESS CONDUCTIVE POLYMER BUMP
- 专利标题（中）： 低应力导电聚合物BUMP
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申请号： US10711185申请日： 2004-08-31
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公开(公告)号： US20060043608A1公开(公告)日： 2006-03-02
- 发明人: William Bernier , Marie Cole , Mukta Farooq , John Knickerbocker , Tasha Lopez , Roger Quon , David Welsh
- 申请人： William Bernier , Marie Cole , Mukta Farooq , John Knickerbocker , Tasha Lopez , Roger Quon , David Welsh
- 申请人地址： US NY Armonk
- 专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人： INTERNATIONAL BUSINESS MACHINES CORPORATION
- 当前专利权人地址： US NY Armonk
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
Disclosed is a laminated (or non-laminated) conductive interconnection for joining an integrated circuit device to a device carrier, where the conductive interconnection comprises alternating metal layers and polymer layers. In addition, the polymer can include dendrites, metal projections from the carrier or device, and/or micelle brushes on the outer portion of the polymer. The polymer layers include metal particles and the alternating metal layers and polymer layers form either a cube-shaped structure or a cylinder-shaped structure.
公开/授权文献
- US07170187B2 Low stress conductive polymer bump 公开/授权日：2007-01-30
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