发明申请
- 专利标题： Underfill injection mold
- 专利标题（中）： 底部注塑模具
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申请号： US10928779申请日： 2004-08-27
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公开(公告)号： US20060046321A1公开(公告)日： 2006-03-02
- 发明人: David Peters
- 申请人： David Peters
- 专利权人： Hewlett-Packard Development Company, L.P.
- 当前专利权人： Hewlett-Packard Development Company, L.P.
- 主分类号： H01L21/66
- IPC分类号： H01L21/66
摘要：
An underfill injection mold includes an inner surface defining a cavity to receive injected underfill substantially between a first substrate and a second substrate. The cavity includes convex, curvilinear sidewalls to define a concave, curvilinear underfill fillet of the injected underfill. In an example, dimensions of the inner surface that define the underfill fillet are based upon a finite element analysis of the underfill.