A construction for DC to AC power inverter includes a circuit board and at least a conductive member. The soldered surface of the circuit board where larger amount of current passes through is inserted with the conductive member. The conductive member provides a contour can be changed in accordance with the shape of the circuit board and the periphery thereof is joined with several inserting pins so that the conductive member can be inversely hooked to the circuit board. Further, the conductive member can adhesively attached to the circuit board tightly by way of operation of tin soldering with the tin furnace. Hence, the conductive member can facially contact with the circuit board to enhance capability of the copper foil on the circuit board to endure the current with lower fabricating cost and promoted utilization efficiency. Besides, obstruction of other electronic parts can be avoided so as to facilitate fabrication process and strengthen market competitive power.