Invention Application
- Patent Title: Bus structure
- Patent Title (中): 总线结构
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Application No.: US11136558Application Date: 2005-05-25
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Publication No.: US20060048969A1Publication Date: 2006-03-09
- Inventor: Kuo-Ching Huang , Yu-Cheng Chang
- Applicant: Kuo-Ching Huang , Yu-Cheng Chang
- Assignee: Primax Electronics Ltd..
- Current Assignee: Primax Electronics Ltd..
- Priority: TW093127020 20040907
- Main IPC: H05K1/03
- IPC: H05K1/03
Abstract:
A bus structure includes multiple soft buses and a soft separation layer. These multiple soft buses are stacked side by side each other. The soft separation layer is sandwitched between two adjacent soft buses.
Public/Granted literature
- US07619166B2 Bus structure Public/Granted day:2009-11-17
Information query
