Invention Application
US20060054181A1 Cleaning method and solution for cleaning a wafer in a single wafer process
有权
用于在单个晶片工艺中清洁晶片的清洁方法和解决方案
- Patent Title: Cleaning method and solution for cleaning a wafer in a single wafer process
- Patent Title (中): 用于在单个晶片工艺中清洁晶片的清洁方法和解决方案
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Application No.: US11146574Application Date: 2005-06-06
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Publication No.: US20060054181A1Publication Date: 2006-03-16
- Inventor: Ronald Rayandayan , Steven Verhaverbeke , Hong Wang
- Applicant: Ronald Rayandayan , Steven Verhaverbeke , Hong Wang
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Main IPC: B08B3/12
- IPC: B08B3/12 ; C23G1/00 ; B08B3/00
Abstract:
The present invention is a method of use of a novel cleaning solution in a single wafer cleaning process. According to the present invention the method involves using a cleaning solution in a single wafer mode and the cleaning solution comprises at least ammonium hydroxide (NH4OH), hydrogen peroxide (H2O2), water (H2O) and a chelating agent. In an embodiment of the present invention the cleaning solution also contains a surfactant. Moreover, the present invention also teaches a method of combining an ammonia hydroxide, hydrogen peroxide, and chelating agent step with a short HF step in a fashion that minimizes process time in a way that the entire method removes aluminum and iron contamination efficiently without etching too much oxide. The single wafer cleaning processes may also be used to increase the yield of high-grade reclaimed wafers.
Public/Granted literature
- US07456113B2 Cleaning method and solution for cleaning a wafer in a single wafer process Public/Granted day:2008-11-25
Information query
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