发明申请
- 专利标题： Electronic component-mounted structure, method for mounting electronic component, electro-optical device, and electronic apparatus
- 专利标题（中）： 电子元件安装结构，电子元件安装方法，电光装置和电子设备
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申请号： US11216807申请日： 2005-08-31
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公开(公告)号： US20060060983A1公开(公告)日： 2006-03-23
- 发明人: Atsushi Saito
- 申请人： Atsushi Saito
- 优先权： JP2004-274625 20040922
- 主分类号： H01L23/48
- IPC分类号： H01L23/48
摘要：
An electronic component-mounted structure includes an electronic component having a bump electrode, the bump electrode including a projection made of a first resin and a conductive film covering at least a top of the projection; a substrate having a connecting terminal; and a second resin filling the space between the electronic component and the substrate, wherein the bump electrode abuts against the connecting terminal, and wherein the relationship T0
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