Invention Application
US20060064190A1 Method and system for dispatching semiconductor component during manufacture
审中-公开
在制造过程中调度半导体元件的方法和系统
- Patent Title: Method and system for dispatching semiconductor component during manufacture
- Patent Title (中): 在制造过程中调度半导体元件的方法和系统
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Application No.: US10944643Application Date: 2004-09-17
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Publication No.: US20060064190A1Publication Date: 2006-03-23
- Inventor: Ming Wang , James Cheng
- Applicant: Ming Wang , James Cheng
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A technique for dispatching semiconductor components for processing is disclosed. The technique includes providing a plurality of lots of semiconductor components. The technique also includes providing a plurality of rules, each including one or more conditions. The technique further includes determining which of the plurality of rules is applicable to a particular lot, and eliminating rules that are not applicable to a particular lot, thus forming a plurality of remaining rules for each particular lot. The technique still further includes applying the plurality of remaining rules to the lots of semiconductor components. If a rule applied to a particular lot activates, processing of the particular lot is inhibited.
Information query