发明申请
- 专利标题: Circuit device and manufacturing method thereof
- 专利标题(中): 电路装置及其制造方法
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申请号: US11237856申请日: 2005-09-29
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公开(公告)号: US20060065421A1公开(公告)日: 2006-03-30
- 发明人: Kazumasa Arai , Yutaka Kubota , Yusuke Igarashi , Hidefumi Saito , Masami Motegi , Noriaki Sakamoto
- 申请人: Kazumasa Arai , Yutaka Kubota , Yusuke Igarashi , Hidefumi Saito , Masami Motegi , Noriaki Sakamoto
- 申请人地址: JP Moriguchi-city JP Ora-gun
- 专利权人: SANYO ELECTRIC CO., LTD.,Kanto SANYO Semiconductors Co., Ltd.
- 当前专利权人: SANYO ELECTRIC CO., LTD.,Kanto SANYO Semiconductors Co., Ltd.
- 当前专利权人地址: JP Moriguchi-city JP Ora-gun
- 优先权: JP2004-288213 20040930
- 主分类号: H05K5/06
- IPC分类号: H05K5/06
摘要:
Warping of a hybrid integrated circuit device 10 due to shrinkage on curing of a sealing resin 14 is suppressed. The hybrid integrated circuit device 10 includes: a conductive pattern 13 provided on a surface of a circuit board 11; circuit elements 15 fixed to the conductive pattern 13; thin metal wires 17 electrically connecting the circuit elements 15 to the conductive pattern; leads 16 which are connected to the conductive pattern 13 to become output or input and extended to the outside; and a sealing resin 14 which is made of a thermosetting resin and covers the circuit board 11 by transfer molding while at least a rear surface of the circuit board is exposed. Here, a thermal expansion coefficient of the sealing resin 14 is set to be smaller than a thermal expansion coefficient of the circuit board 11. Thus, warping of the circuit board 11 in an after cure step can be prevented.