Invention Application
- Patent Title: Alloy composition and plating method
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Application No.: US11265382Application Date: 2005-11-02
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Publication No.: US20060065538A1Publication Date: 2006-03-30
- Inventor: Robert Schetty , Michael Toben , James Martin , Neil Brown , Jeffrey Crosby , Keith Whitlaw
- Applicant: Robert Schetty , Michael Toben , James Martin , Neil Brown , Jeffrey Crosby , Keith Whitlaw
- Applicant Address: US MA Marlborough
- Assignee: Shipley Company, L.L.C.
- Current Assignee: Shipley Company, L.L.C.
- Current Assignee Address: US MA Marlborough
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D3/30
Abstract:
Disclosed are electrolyte compositions for depositing tin-copper alloys that are substantially free of lead. Also disclosed are methods of plating tin-copper alloys that are substantially free of lead on substrates and uses for such plated substrates.
Information query
