发明申请
- 专利标题： Using ozone to process wafer like objects
- 专利标题（中）： 使用臭氧来处理晶片像物体
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申请号： US11226918申请日： 2005-09-13
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公开(公告)号： US20060070979A1公开(公告)日： 2006-04-06
- 发明人: Kurt Christenson , Philip Clark
- 申请人： Kurt Christenson , Philip Clark
- 主分类号： B08B6/00
- IPC分类号： B08B6/00 ; C03C15/00 ; H01L21/306
摘要：
The present invention relates to methods of processing wafer-like objects (e.g., having an exposed copper feature and/or including low-k dielectric material) with ozone. In certain preferred embodiments, a base is also used to process the wafer-like object(s).
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