Invention Application
- Patent Title: Multilayer printed circuit board
- Patent Title (中): 多层印刷电路板
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Application No.: US11247341Application Date: 2005-10-11
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Publication No.: US20060076160A1Publication Date: 2006-04-13
- Inventor: Shou-Kuo Hsu , Yu-Chang Pai , Cheng-Hong Liu
- Applicant: Shou-Kuo Hsu , Yu-Chang Pai , Cheng-Hong Liu
- Applicant Address: TW Tu-Cheng City
- Assignee: HON HAI Precision Industry CO., LTD.
- Current Assignee: HON HAI Precision Industry CO., LTD.
- Current Assignee Address: TW Tu-Cheng City
- Priority: CN200410051838.X 20041009
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A multilayer printed circuit board (PCB) includes a plurality of signal planes, two reference planes, a signal via, and a stitching via. The signal via passes through all planes for a signal trace flowing therethrough. The stitching via is defined near the signal via and electrically connects to one of the reference plane. The stitching via serves as a stitching capacitor, to reduce the area of the signal current flows in the PCB, even to control crosstalk and lower the noise on the PCB. It is of advantage that the stitching via is simple to manufacture and very suitable for mass production.
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