Invention Application
- Patent Title: Silicon wafer laser processing method and laser beam processing machine
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Application No.: US11242019Application Date: 2005-10-04
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Publication No.: US20060079069A1Publication Date: 2006-04-13
- Inventor: Yusuke Nagai , Yukio Morishige , Yosuke Watanabe
- Applicant: Yusuke Nagai , Yukio Morishige , Yosuke Watanabe
- Assignee: Disco Corporation
- Current Assignee: Disco Corporation
- Priority: JP2004-294473 20041007
- Main IPC: H01L21/324
- IPC: H01L21/324 ; H01L21/42 ; H01L21/477 ; H01L21/26 ; H01L21/30 ; H01L21/46
Abstract:
A silicon wafer laser processing method for forming a deteriorated layer along dividing lines formed on a silicon wafer in the inside of the silicon wafer by applying a laser beam along the dividing lines, wherein the wavelength of the laser beam is set to 1,100 to 2,000 nm.
Public/Granted literature
- US07553777B2 Silicon wafer laser processing method and laser beam processing machine Public/Granted day:2009-06-30
Information query
IPC分类:
