发明申请
- 专利标题： CMP conditioner
- 专利标题（中）： CMP调理剂
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申请号： US11231545申请日： 2005-09-20
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公开(公告)号： US20060079162A1公开(公告)日： 2006-04-13
- 发明人: Tetsuji Yamashita , Takashi Kimura , Hanako Hata
- 申请人： Tetsuji Yamashita , Takashi Kimura , Hanako Hata
- 申请人地址： JP Tokyo
- 专利权人： Mitsubishi Materials Corporation
- 当前专利权人： Mitsubishi Materials Corporation
- 当前专利权人地址： JP Tokyo
- 优先权： JP2004-274912 20040922
- 主分类号： B24B21/18
- IPC分类号： B24B21/18
摘要：
A CMP conditioner is provided in which diamond grit that is adhered to a conditioning surface so as to face and be in contact with a polishing pad of a CMP apparatus is adhered such that 111 surfaces of crystal surfaces of the diamond grit are substantially parallel with the conditioning surface and face in a direction faced by the conditioning surface.
公开/授权文献
- US07150677B2 CMP conditioner 公开/授权日：2006-12-19
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