- 专利标题: Wafer dividing apparatus
-
申请号: US11249494申请日: 2005-10-14
-
公开(公告)号: US20060081574A1公开(公告)日: 2006-04-20
- 发明人: Yusuke Nagai
- 申请人: Yusuke Nagai
- 专利权人: Disco Corporation
- 当前专利权人: Disco Corporation
- 优先权: JP2004-306041 20041020
- 主分类号: B23K26/16
- IPC分类号: B23K26/16
摘要:
A wafer dividing apparatus for dividing a wafer whose strength is reduced along a plurality of dividing lines, along the dividing lines, which comprises a tape holding means for holding a protective tape affixed to one side of the wafer; and wafer dividing means, each comprising a plurality of tension application means comprising a first suction-holding member and a second suction-holding member for suction-holding the wafer held on the tape holding means through the protective tape on both sides of a dividing line, and moving means for moving the first suction-holding members and the second suction-holding members in such directions that they separate from each other.
公开/授权文献
- US07497213B2 Wafer dividing apparatus 公开/授权日:2009-03-03