Systems, methods and slurries for chemical mechanical polishing

Invention Application

US20060084271A1 Systems, methods and slurries for chemical mechanical polishing 审中-公开

Title translation: 化学机械抛光的系统，方法和浆液

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Patent Title: Systems, methods and slurries for chemical mechanical polishing
Patent Title (中): 化学机械抛光的系统，方法和浆液
Application No.: US10970547

Application Date: 2004-10-20
Publication No.: US20060084271A1

Publication Date: 2006-04-20
Inventor: Andy Yang , Chris Yu
Applicant: Andy Yang , Chris Yu
Main IPC: H01L21/461
IPC: H01L21/461 ; B44C1/22 ; C23F1/00

Systems, methods and slurries for chemical mechanical polishing

Abstract:

Process, slurries formulation and polishing mechanism are disclosed for the formation of silver (Ag) or Ag alloy film features on a substrate using CMP. The process and slurries can achieve Ag or Ag alloy film features with good planarization, low roughness, high reflectivity, and low defectivity.

Abstract(Chinese):

公开了用于使用CMP在衬底上形成银（Ag）或Ag合金膜特征的工艺，浆料配方和抛光机理。该工艺和浆料可以实现Ag或Ag合金膜的特征，具有良好的平面化，低粗糙度，高反射率和低缺陷性。

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IPC分类:

H	电学
H01	基本电气元件
H01L	半导体器件；其他类目中不包括的电固体器件（使用半导体器件的测量入G01；一般电阻器入H01C；磁体、电感器、变压器入H01F；一般电容器入H01G；电解型器件入H01G9/00；电池组、蓄电池入H01M；波导管、谐振器或波导型线路入H01P；线路连接器、汇流器入H01R；受激发射器件入H01S；机电谐振器入H03H；扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R；一般电光源入H05B；印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K；在具有特殊应用的电路中使用的半导体器件见应用相关的小类）
H01L21/00	专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02	.半导体器件或其部件的制造或处理
H01L21/04	..至少具有一个跃变势垒或表面势垒的器件，例如PN结、耗尽层、载体集结层
H01L21/34	...具有H01L21/06，H01L21/16及H01L21/18各组不包含的或有或无杂质，例如掺杂材料的半导体的器件
H01L21/46	....用H01L21/36至H01L21/428各组不包含的方法或设备处理半导体材料的（在半导体材料上制作电极的入H01L21/44）
H01L21/461	.....改变半导体材料的表面物理特性或形状的，例如腐蚀、抛光、切割