Invention Application
- Patent Title: FLEXIBLE LAND GRID ARRAY CONNECTOR
- Patent Title (中): 柔性地板阵列连接器
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Application No.: US10969369Application Date: 2004-10-19
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Publication No.: US20060084288A1Publication Date: 2006-04-20
- Inventor: Ping Chuang , Li-Sen Chen , Chien-Yu Hsu
- Applicant: Ping Chuang , Li-Sen Chen , Chien-Yu Hsu
- Main IPC: H01R12/00
- IPC: H01R12/00

Abstract:
An LGA connector is used to interconnect an LGA package and a printed circuit board. The LGA connector includes an elastomeric body with a plurality of through-holes. Metal films are formed on inner walls of through-holes and splay out around the mouths of their upper and lower openings. The metal films are formed by vacuum metallization, sputtering, chemical plating, electrical plating or PVD. The through-holes have a funnel-like shape to absorb external stresses and redirect the stress to shrink the through-hole diameters. Moreover, the metal films' elastic deformation is larger than conventional metal conductive fillers so as to improve reliability.
Public/Granted literature
- US07021941B1 Flexible land grid array connector Public/Granted day:2006-04-04
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