发明申请
- 专利标题: Surface-mount capacitor and method of producing the same
- 专利标题(中): 表面贴装电容器及其制造方法
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申请号: US11260831申请日: 2005-10-27
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公开(公告)号: US20060087795A1公开(公告)日: 2006-04-27
- 发明人: Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
- 申请人: Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
- 申请人地址: JP Sendai-shi JP Shimoniikawa-gun
- 专利权人: NEC TOKIN Corporation,NEC TOKIN Toyama, Ltd.
- 当前专利权人: NEC TOKIN Corporation,NEC TOKIN Toyama, Ltd.
- 当前专利权人地址: JP Sendai-shi JP Shimoniikawa-gun
- 优先权: JP2004-311928 20041027
- 主分类号: H01G4/228
- IPC分类号: H01G4/228
摘要:
A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
公开/授权文献
- US07206193B2 Surface-mount capacitor and method of producing the same 公开/授权日:2007-04-17
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