- 专利标题: Wafer alignment method for dual beam system
-
申请号: US11258939申请日: 2005-10-27
-
公开(公告)号: US20060091321A1公开(公告)日: 2006-05-04
- 发明人: Hiroyasu Kaga , Hiroyuki Suzuki , Yutaka Hojyo
- 申请人: Hiroyasu Kaga , Hiroyuki Suzuki , Yutaka Hojyo
- 专利权人: HITACHI HIGH-TECHNOLOGIES CORPORATION
- 当前专利权人: HITACHI HIGH-TECHNOLOGIES CORPORATION
- 优先权: JP2004-314089 20041028
- 主分类号: G01N23/00
- IPC分类号: G01N23/00
摘要:
A gradient charged particle beam apparatus capable of moving highly accurately to a specific position by eliminating influences of warp inside a wafer surface is provided. A portion 46 having a mark 47 for aligning visual field alignment positioned in advance to the same horizontal and the same height as a stage plane as a reference point is arranged on a wafer holder. A height of an observation point on a sample is adjusted to the height of the mark 47 and the visual field of a gradient column is brought into conformity with the visual field of a vertical column by use of a known offset between the gradient column and the vertical column at that time.
公开/授权文献
- US07323697B2 Wafer alignment method for dual beam system 公开/授权日:2008-01-29