发明申请
US20060091435A1 Organic electronic circuit and method for making the same 失效
有机电子电路及其制作方法

Organic electronic circuit and method for making the same
摘要:
In an organic electronic circuit (C), particularly a memory circuit with an organic ferroelectric or electret material (2) the active material comprises fluorine atoms and consists of various organic materials. The active material is located between first and second electrode sets constituting respectively bottom and top electrodes (1a;1b) of the device. A cell with a capacitor-like structure is defined in the active material (2) and can be accessed for an addressing operation via the electrodes. At least one top electrode (1b) comprises a layer of gold in contact with active material. A second layer (12) on the top electrode (1b) comprises conducting material different from gold or can alternatively also be made of gold. A via connection (13) extends between the second electrode layer (12) and a bottom electrode (1a) or another electrode (1b) in the bottom electrode layer. In case the second electrode layer (12) is made of gold the via metal of the via connection can also be gold and integral with the second electrode layer (12). In a method for establishing a top via electrode connection in the device (M), a first top electrode layer of gold is deposited and a via hole etched therethrough and down to the bottom electrode layer, and via metal is deposited to form a via connection (13) and then a second top electrode layer (12) is deposited above the first electrode layer of gold and contacting the via connection.
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IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L29/00 专门适用于整流、放大、振荡或切换,并具有至少一个电位跃变势垒或表面势垒的半导体器件;具有至少一个电位跃变势垒或表面势垒,例如PN结耗尽层或载流子集结层的电容器或电阻器;半导体本体或其电极的零部件(H01L31/00至H01L47/00,H01L51/05优先;除半导体或其电极之外的零部件入H01L23/00;由在一个共用衬底内或其上形成的多个固态组件组成的器件入H01L27/00)
H01L29/66 .按半导体器件的类型区分的
H01L29/86 ..只能通过对一个或多个通有待整流,放大、振荡或切换的电流的电极供给电流的变化或施加电位的变化方可进行控制的(H01L29/96优先)
H01L29/92 ...有电位跃变势垒或表面势垒的电容器
H01L29/94 ....金属—绝缘体—半导体,例如MOS
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