发明申请
- 专利标题： Film circuit substrate having Sn-In alloy layer
- 专利标题（中）： 具有Sn-In合金层的膜电路基板
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申请号： US11256650申请日： 2005-10-21
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公开(公告)号： US20060091504A1公开(公告)日： 2006-05-04
- 发明人: Un-Byoung Kang , Chung-Sun Lee , Sa-Yoon Kang , Yong-Hwan Kwon
- 申请人： Un-Byoung Kang , Chung-Sun Lee , Sa-Yoon Kang , Yong-Hwan Kwon
- 优先权： KR2004-84517 20041021
- 主分类号： H01L23/58
- IPC分类号： H01L23/58
摘要：
In one embodiment, a film circuit substrate comprises an insulating film made of polyimide resin; a conductive circuit pattern formed on the insulating film, the circuit pattern including an inner lead to be connected with a conductive bump of a semiconductor chip through a bump bonding process; and a tin-indium alloy layer formed on the inner lead to produce an inter-metallic compound layer of AuxSn composition during the bump bonding process.
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