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发明申请
US20060097371A1 Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads 审中-公开
树脂密封半导体器件，具有管芯焊盘的引线框，以及具有管芯焊盘的引线框架的制造方法

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads
摘要：
A resin-sealed semiconductor device with built-in heat sink prevents internal bulging and cracking caused by exfoliation of a semiconductor element from the heat sink when the vapor pressure of moisture absorbed into a gap between the semiconductor element and the heat sink rises during mounting of the semiconductor device to a printed circuit board using lead-free solder. By providing a plurality of separated die pads (502) in a mounting area for a semiconductor element (301) and adhering the semiconductor element (301) to the heat sink (105) via the die pads (502), space is opened up between the semiconductor element (301) and the heat sink (105) for sealing resin (304) to run into.
摘要（中）：

具有内置散热器的树脂密封半导体器件在吸收到半导体元件和散热片之间的间隙中的水分的蒸气压在安装期间升高时防止半导体元件从散热器脱落引起的内部凸起和破裂 将半导体器件用于使用无铅焊料的印刷电路板。 通过在用于半导体元件（301）的安装区域中设置多个分离的管芯焊盘（502）并且经由管芯焊盘（502）将半导体元件（301）粘附到散热器（105）上， 半导体元件（301）和用于密封树脂（304）进入的散热片（105）。

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