发明申请
- 专利标题： Electronic device package and electronic equipment
- 专利标题（中）： 电子设备包装和电子设备
-
申请号： US11256594申请日： 2005-10-21
-
公开(公告)号： US20060097373A1公开(公告)日： 2006-05-11
- 发明人: Wataru Ito
- 申请人： Wataru Ito
- 优先权： JP2004-327710 20041111; JP2004-327711 20041111; JP2005-204230 20050713
- 主分类号： H01L23/02
- IPC分类号： H01L23/02 ; H01L21/48
摘要：
An electronic device to be loaded on an electronic equipment or an electronic component is mounted on a mount substrate, the mount substrate being made thin and flexible and having strong resistance to bending. An electronic device package including: a flexible substrate having a wiring pattern formed thereon; and an electronic device having a terminal formation face on which a connection terminal is provided, wherein the connection terminal is electrically connected directly or via a conductive member to the wiring pattern, and the terminal formation face is substantially aligned in a neutral plane of bending in a thickness direction of the electronic device package.
公开/授权文献
- US07385280B2 Electronic device package and electronic equipment 公开/授权日：2008-06-10
信息查询
IPC分类:
